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PPS 2200
Wafer-level bonding machine
 Specifications |
|
| Catalog No. : | 3571 |
| Type: | PPS 2200 |
| Producer: | DATACON |
| Made in: | 1997 |
| Characteristic: | |
| Coloring: | |
| Lower cover: dark gray powder 56.900 70 M | |
| Upper panel: light gray powder 56.900 60 m | |
| Upper frame: ultramarine blue RAL 5002 | |
| Control surface: water blue RAL 5021 | |
| Control: VME bus / CAN bus | |
| Operator - Monitor / Operator - Interface: | |
| 15 "Flat Screen Monitor / Windows - similar | |
| Operating system: Vx - Works | |
| Network card (CONV-500): | |
| Plug for network connection: | |
| 10BaseT 10Base2 and AUI | |
| Data storage: | |
| Internal - Hard disk | |
| External - 3.5 "drive (only HD disks with 1.44 MB) | |
| Chip sizes 0.2 - 20 mm | |
| (Manual adjustment of ejection system ejection kits required) | |
| Chip thicknesses> 0.15 mm | |
| Wafer sizes: up to 203 mm (8 ") | |
| Frame sizes: up to 276 mm (11 ") | |
| substrate: | |
| Substrate size (transport system) | |
| Max. 255x203x30 mm | |
| Component height (eg SMD's) | |
| Max. 30 mm. with tool changer up to 10 mm | |
| Substrate transport height (SMEMA 1.2) 940 - 945 mm or 37 - 38 " | |
| Max. Number of bond points: 100 per chip type | |
| Max. Number of individual uses / substrate 100 with free programming | |
| 60.000 in matrix programming | |
| Max. Number of individual substrates / transport unit | |
| (Carrier or boot) 300 | |
| Tool changer: | |
| Max. Number of tool holders 6 | |
| Tool change time approx. 1.5 sec | |
| . Outdo system changer: | |
| Max. Number of change tools 5 | |
| Tool change time ca: 4 sec. (When changing from the 1st to the 4th tool | |
| this time is integrated in the wafer change time | |
| and is therefore not decisive) | |
| Epoxy module: | |
| Work area (X/Y/Z) 254x200x50 mm | |
| dispenser: | |
| Feed method (standard) Metering via feed spindle | |
| Feed Method (optional) Pressure / Time - Dose | |
| Cartridge sizes: | |
| 5. 10. and 30 ccm (on the additional Z-axis only up to 10 ccm) | |
| Pick & Place module: | |
| Working area (XYZ) 254x200x30 mm | |
| Working area with additional Z-axis 200x200x30 mm | |
| Machine dimensions: 800x1200x2000 mm | |
| Machine weight: 700 kg | |
| Documentation / MANUAL is in German | |
Gallery
